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1sna174021r1600 – perforated pcb 115
TE Connectivity 1SNA174021R1600 CI 115 is a 48.3 x 45.2 mm pre-punched epoxy PCB with a 2.54 mm hole pitch, 1.05 mm matrix holes and 35 µm copper for customised circuits in compatible ENTRELEC empty modules.
£5.64
Why Choose the TE Connectivity 1SNA174021R1600 CI 115 Perforated PCB?
The TE Connectivity 1SNA174021R1600, product designation CI 115, is a pre-punched printed circuit board (PCB) designed for use with compatible TE Connectivity / ENTRELEC empty component-holder modules. It provides a convenient matrix-style platform for mounting electronic components and creating customised interface circuits within DIN rail-mounted industrial control systems.
The CI 115 PCB is manufactured from UL94 V-0 epoxy resin with a 35 µm copper thickness. Its matrix is pre-punched with 1.05 mm holes on a 2.54 mm pitch, providing the standard 0.1-inch spacing commonly used for through-hole electronic components and allowing flexible circuit layouts to be assembled for specific control applications.
Measuring approximately 48.3 × 45.2 mm, the 1SNA174021R1600 is designed for compatible CI 115 / empty-module assemblies. It is particularly useful for integrating relays, opto-isolators and associated electronic circuitry into modular DIN rail-mounted interface systems.
Key Advantages
- Purpose-designed pre-punched PCB for compatible empty component modules.
- Standard 2.54 mm hole pitch supports common through-hole components.
- 1.05 mm pre-punched holes provide a flexible matrix for circuit assembly.
- Manufactured from UL94 V-0 epoxy resin.
- 35 µm copper thickness for PCB circuit construction.
- Suitable for customised DIN rail-mounted interface and control circuits.
Key Features
- TE Connectivity / ENTRELEC CI 115 printed circuit board.
- Pre-punched matrix PCB configuration.
- Approximate PCB dimensions of 48.3 × 45.2 mm.
- 2.54 mm hole spacing.
- 1.05 mm matrix hole diameter.
- 35 µm copper layer thickness.
- UL94 V-0 epoxy resin board material.
- Designed for compatible TE Connectivity / ENTRELEC empty modules.
Flexible PCB Platform for DIN Rail Interface Modules
Pre-punched matrix PCBs allow engineers to build application-specific electronic circuits without requiring a dedicated production PCB for every design. Components can be positioned across the standard hole matrix and interconnected to create compact control, isolation and signal-conditioning circuits.
When installed within a compatible ENTRELEC component-holder module, the CI 115 provides a practical way to integrate electronic circuitry into DIN rail control assemblies. Typical configurations can incorporate PCB relays, opto-isolators and associated signal-interface components while retaining an organised modular panel layout.
Typical Applications
- DIN rail-mounted electronic interface modules.
- PCB relay and associated control circuits.
- Opto-isolator interface circuits.
- Signal conditioning and interfacing.
- Industrial automation and control panels.
- Custom electronic circuits in compatible empty modules.
Technical Specifications
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| Product Series | TE SNA | |
|---|---|---|
| Manufacturer | TE Connectivity / ENTRELEC | |
| Series | Empty Module / Component Holder Modules | |
| Model | CI 115 | |
| Part number | 1SNA174021R1600 | |
| Product type | Pre-punched printed circuit board | |
| PCB dimensions | approx. 48.3 × 45.2 mm | |
| Hole pitch | 2.54 mm | |
| Matrix hole diameter | 1.05 mm | |
| Material | Epoxy resin | |
| Flammability rating | UL94 V-0 | |
| Copper thickness | 35 µm | |
| Application | Compatible empty component-holder modules | |
| Pack quantity | 10 | |
| EAN | 3472591740219 |
Frequently Asked Questions
What is the TE Connectivity 1SNA174021R1600?
The 1SNA174021R1600 is a CI 115 pre-punched printed circuit board designed for use inside compatible TE Connectivity / ENTRELEC empty component-holder modules.
What is the hole spacing on the CI 115 PCB?
The matrix uses a standard 2.54 mm pitch, equivalent to the common 0.1-inch spacing used by many through-hole electronic components.
What diameter are the pre-punched holes?
The CI 115 matrix is pre-punched with holes measuring approximately 1.05 mm in diameter.
What material is the 1SNA174021R1600 PCB made from?
The circuit board is manufactured from UL94 V-0 epoxy resin and has a specified copper thickness of 35 µm.
What applications is the CI 115 PCB suitable for?
The CI 115 is suitable for creating customised electronic interfaces incorporating components such as PCB relays, opto-isolators and associated signal-interface circuitry within compatible DIN rail-mounted modules.
Flexible Circuit Integration for Industrial Automation
TE Connectivity / ENTRELEC component-holder systems provide a practical modular platform for integrating customised electronic circuitry into industrial control panels, with the CI 115 pre-punched PCB supporting flexible component layouts and DIN rail-mounted interface applications.
