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HSBXP0050 Lovato THERMAL PAD KIT 50PCS FOR HS1B – HS2B
Lovato HSBXP0050 is a 50-piece adhesive thermal pad kit for HS1B and HS2B solid state relays, designed to improve heat transfer between the relay and its heat sink or metal mounting panel.
£2.80
Why Choose the Lovato HSBXP0050 Thermal Pad Kit?
The Lovato HSBXP0050 is a dedicated adhesive thermal pad for Lovato HS1B and HS2B solid state relays, designed to improve heat transfer between the relay and its heat sink or metal mounting panel. As part of the Lovato HSBX solid state relay accessory range, it provides a simple and effective thermal interface for maintaining reliable solid state relay performance.
Solid state relays generate heat while conducting load current, making effective thermal dissipation important for dependable operation. Installing the HSBXP0050 on the rear of a compatible relay helps transfer this heat through the heat sink or panel, supporting efficient cooling and helping to prevent excessive operating temperatures.
The HSBXP0050 is specifically designed for Lovato HS1B and HS2B solid state relays. This version is supplied as a 50-piece ordering pack, making it particularly suitable for panel builders, OEM manufacturers and maintenance departments installing multiple solid state relays.
Key Advantages
- Purpose-designed thermal interface for Lovato HS1B and HS2B solid state relays.
- Promotes effective heat transfer between the relay and heat sink or mounting panel.
- Adhesive thermal pad simplifies positioning during installation.
- Helps reduce the risk of excessive relay operating temperatures.
- Supports reliable performance in demanding industrial switching applications.
- Convenient 50-piece ordering quantity for multiple installations.
- Designed as part of the Lovato HSBX solid state relay accessory system.
Key Features
- Lovato HSBX solid state relay accessory range.
- Adhesive thermal pad for solid state relay installations.
- Compatible with Lovato HS1B and HS2B relay families.
- Installed on the rear of the solid state relay.
- Improves thermal transfer to a compatible heat sink or metal mounting panel.
- Suitable for industrial electrical panels and automation equipment.
- Designed to support effective heat dissipation and reliable relay operation.
- 50-piece ordering quantity.
Effective Thermal Management for Solid State Relays
Solid state relays dissipate electrical power as heat while switching and conducting load current. Effective transfer of this heat from the relay to its heat sink or metal mounting surface is important for maintaining suitable operating temperatures and supporting reliable semiconductor performance.
The Lovato HSBXP0050 is applied to the rear of compatible HS1B and HS2B solid state relays to provide an effective thermal interface with the heat sink or panel. Used with an appropriately selected cooling arrangement, the thermal pad helps optimise heat dissipation in industrial control and automation installations.
Typical Applications
- Lovato HS1B solid state relay installations.
- Lovato HS2B solid state relay installations.
- Industrial electric heating control systems.
- Temperature and process control panels.
- Packaging and production machinery.
- Industrial automation equipment.
- OEM machine building and panel assembly.
- Maintenance and replacement of solid state relay thermal interfaces.
Technical Specifications
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| Device Type | Accessory | |
|---|---|---|
| Mounting Type | Panel | |
| Manufacturer | Lovato Electric | |
| Series | HSBX | |
| Model | HSBXP0050 | |
| Product type | Solid state relay thermal accessory | |
| Accessory type | Adhesive thermal pad | |
| Compatible relay families | HS1B and HS2B | |
| Installation position | Between solid state relay and heat sink or metal mounting panel | |
| Ordering quantity | 50 pieces | |
| Individual pad weight | 0.751 g | |
| Package dimensions | 97 × 65 × 90 mm | |
| Package volume | 11.349 cm³ | |
| EAN | 8013975322444 | |
| HS code | 85389099 | |
| Applicable standards | IEC/EN/BS 60947-4-2, IEC/EN/BS 60947-4-3, IEC/EN/BS 62314 and IEC/EN/BS 60335-1 |
Frequently Asked Questions
What is the Lovato HSBXP0050 used for?
The HSBXP0050 is an adhesive thermal pad for Lovato HS1B and HS2B solid state relays, designed to improve heat transfer from the relay to its heat sink or metal mounting panel.
Which solid state relays are compatible with the HSBXP0050?
The HSBXP0050 is specifically designed for use with Lovato HS1B and HS2B solid state relays.
Where is the HSBXP0050 thermal pad installed?
The thermal pad is applied to the rear of the solid state relay between the relay and its heat sink or metal mounting panel to promote effective heat transfer.
Why is a thermal pad used with a solid state relay?
A thermal pad helps provide an effective thermal interface between the relay and cooling surface, improving heat dissipation and supporting reliable relay operation.
How many thermal pads are supplied with the HSBXP0050?
The HSBXP0050 is the 50-piece ordering version of the Lovato thermal pad for HS1B and HS2B solid state relays.
Trusted Thermal Management from Lovato Electric
Lovato Electric HSBX thermal accessories provide purpose-designed heat-transfer solutions for HS series solid state relays, helping panel builders, machine manufacturers and automation engineers achieve effective thermal management in industrial switching applications.
