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Rittal SK 3312.570 LCP Inline CW is a 35 kW water/glycol Liquid Cooling Package with EC fan technology, IP20 protection and 1200 mm depth for efficient server and data centre cooling.
The Rittal SK 3312.570 is a high-performance Liquid Cooling Package (LCP) Inline CW designed for efficient cooling of server racks and IT infrastructure in demanding data centre environments. As part of the advanced Rittal LCP Inline CW series, this chilled-water cooling unit is designed for installation within a bayed enclosure suite, extracting hot server exhaust air at the rear, cooling it through an integrated air/water heat exchanger and supplying cooled air towards the cold aisle.
The LCP Inline CW combines efficient EC fan technology with dynamic cooling control to minimise electrical energy consumption while maintaining reliable server inlet temperatures. Continuous control of the cold-water volume flow and linear fan regulation allow cooling performance to adapt to changing IT loads, while the separation of the cooling unit from the adjacent server enclosure helps prevent water from entering sensitive IT equipment.
With a maximum cooling output of 35 kW and dimensions of 300 × 2000 × 1200 mm (W × H × D), the SK 3312.570 provides substantial cooling capacity from a compact footprint. The unit uses a water/glycol cooling medium, incorporates four EC fan modules as supplied and features optimised condensate management for dependable operation in modern data centres.
The Rittal LCP Inline CW cooling principle is designed to manage high thermal loads generated by modern servers and other IT equipment. Hot exhaust air is drawn into the rear of the cooling unit and passes through an integrated air/water heat exchanger before the conditioned air is discharged towards the cold aisle for reuse by the IT equipment.
EC fan technology, continuous cold-water flow regulation and intelligent temperature control enable the cooling system to respond efficiently to changing server loads. The ability to use comparatively high water inlet temperatures can also increase opportunities for indirect free cooling and help reduce data centre operating costs, while high water return temperatures can support heat-recovery applications.
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| Device Type | Wall / door-mounted cooling unit | |
|---|---|---|
| Coil / Supply Voltage | 230 V AC, 1-phase | |
| IP Rating | IP20 | |
| Voltage | 230 V AC | |
| Cooling Output (W) | 35000 W | |
| Manufacturer | Rittal | |
| Series | Liquid Cooling Package LCP Inline CW / CWG | |
| Model | SK 3312.570 | |
| Product type | Liquid Cooling Package / chilled-water data centre cooling unit | |
| Maximum cooling output | 35 kW | |
| Cooling medium | Water/glycol | |
| Rated operating voltage | 230 V, 1-phase, 50/60 Hz / 400 V, 3-phase, 50/60 Hz | |
| Electrical connection | Connector | |
| Duty cycle | 100% | |
| Fan technology | EC fans | |
| Fan modules supplied | 4 | |
| Temperature control | Linear fan control and two-way control valve | |
| Water connections | DN 40 (G 1½" external thread) | |
| Maximum permissible operating pressure | 10 bar | |
| Water inlet temperature | 15 °C | |
| Width | 300 mm | |
| Height | 2000 mm | |
| Depth | 1200 mm | |
| Dimensions (W × H × D) | 300 × 2000 × 1200 mm | |
| Net weight | 241 kg | |
| Gross weight | 260 kg | |
| Colour | RAL 7035 | |
| Installation | Bayed enclosure suite, set forward | |
| EAN | 4028177811614 |
The Rittal SK 3312.570 is an LCP Inline CW liquid cooling unit designed to remove heat from server and IT equipment installations in data centres and other high-density computing environments.
The SK 3312.570 provides a maximum cooling output of 35 kW, making it suitable for cooling high-density IT and server installations.
The unit is designed to operate with a water/glycol cooling medium through its integrated air/water heat exchanger.
The unit measures 300 × 2000 × 1200 mm (W × H × D), including a depth of 1200 mm.
The Rittal SK 3312.570 has an IP20 protection rating to IEC 60529.
Rittal LCP Inline cooling systems are engineered for efficient thermal management of modern IT infrastructure, combining high cooling capacity, EC fan technology, intelligent control and a compact footprint for demanding data centre environments.
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