SK3312.230 Rittal Liquid Cooling Package LCP Rack CW

Why Choose the Rittal SK3312.230 LCP Rack CW?

The Rittal SK3312.230 Liquid Cooling Package LCP Rack CW is a high-performance chilled-water rack cooling system engineered for targeted thermal management of high-density servers and critical IT infrastructure. Its integrated air/water heat exchanger supports a maximum cooling output of 30 kW, allowing one or two adjacent server racks to be cooled independently of the surrounding room air.

The LCP Rack CW draws heated air laterally from the rear of the server enclosure, passes it through the high-performance air/water heat exchanger and supplies cooled air laterally towards the front of the rack. Dynamic control of chilled-water volume flow, continuously variable EC fan control and redundant air-side temperature sensing help maintain controlled server inlet temperatures while minimising unnecessary fan and cooling energy consumption.

Measuring 300 mm wide × 2000 mm high × 1200 mm deep, the SK3312.230 is designed for flush integration alongside compatible Rittal TS IT enclosures. One EC fan module is supplied for up to 10 kW cooling, with the modular architecture allowing additional fan modules to increase total cooling capacity to 20 kW or 30 kW as IT heat loads grow.

Key Advantages

• Scalable chilled-water rack cooling with up to 30 kW maximum cooling output.
• Supplied with one EC fan module for up to 10 kW cooling capacity.
• Expandable to 20 kW with two fan modules or 30 kW with three fan modules.
• Energy-efficient EC fan technology and IT-oriented cooling control.
• Dynamic, continuous control of chilled-water volume flow adapts performance to cooling demand.
• Redundant air-side temperature sensing supports dependable server inlet temperature control.
• Fan modules can be configured for n+1 redundancy.
• Fans can be exchanged while the cooling system remains operational.
• High chilled-water inlet temperatures can increase the potential for energy-saving indirect free cooling.
• Direct network monitoring supports integration into professional data centre management systems.

Key Features

• Rittal LCP Rack CW chilled-water cooling system.
• 30 kW maximum cooling output.
• 10 kW / 20 kW / 30 kW modular cooling configurations.
• One EC fan module supplied as standard.
• Up to 4,800 m³/h unimpeded airflow at 50 Hz.
• Continuously variable fan control.
• Two-way control valve for chilled-water regulation.
• Monitoring of server intake and exhaust temperatures, water temperatures, water flow, cooling output, fan speed and leakage.
• Direct connection via SNMP over Ethernet.
• Designed for flush integration with compatible Rittal TS IT enclosures.
• 1200 mm depth for integration alongside deep server racks.

Scalable Chilled-Water Cooling for High-Density IT

Modern servers, storage systems and network hardware can generate concentrated heat loads that require cooling directly at rack level. The Rittal SK3312.230 uses an integrated air/water heat exchanger mounted alongside the server rack, drawing warm exhaust air from the rear and returning conditioned air towards the equipment intake side. This enclosure-based approach helps minimise dependence on room-level airflow and supports controlled server inlet temperatures.

Its modular EC fan architecture allows cooling capacity to grow with the IT installation. One fan module supports up to 10 kW, while additional modules increase total capacity to 20 kW or 30 kW. Continuous regulation of fan speed and chilled-water flow helps match cooling performance to actual demand, while the ability to configure fan redundancy supports the availability requirements of critical data centre infrastructure.

Typical Applications

• High-density server rack cooling.
• Enterprise and colocation data centres.
• Server rooms with chilled-water infrastructure.
• Rittal TS IT enclosure installations.
• High-performance computing environments.
• Storage and network infrastructure cooling.
• Data centres requiring scalable rack-level cooling capacity.
• IT installations requiring room-independent thermal management.
• Critical computing environments requiring redundant cooling configurations.